Method for manufacturing a multi-functional module and device including same

摘要

The method involves producing a multilayer structure module (1) including electrical/electronic components arranged on a flexible substrate (2) in superimposed layers, where the electrical/electronic components respectively comprise main faces (10, 11) exposed to an outer side. The electrical/electronic components are arranged to present the respective main faces oriented in opposite directions with each other. An independent claim is also included for a multifunctional device comprising a multilayer structure module.