Interconnection device for electronic circuits, in particular hyperfrequency electronic circuits

摘要

The device (100) has a transmission line (103) connected to a ground line (104), where the transmission and ground lines are formed on a side of a dielectric substrate (101). A metallization surface forms a coupling element on another side of the dielectric substrate for reinforcing an electrical coupling between the transmission and ground lines. The coupling element is arranged on a surface equal to a surface occupied by the transmission and ground lines, where interconnection is formed at ends of the transmission and ground lines.