发明名称 |
SEMICONDUCTOR PROTECTION FILM-FORMING FILM WITH DICING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE |
摘要 |
<p>The present invention includes a dicing sheet-attached film for forming a semiconductor protection film (14), which protects a semiconductor element (18) mounted on a base material and positioned on the outermost side. The dicing sheet-attached film for forming a semiconductor protection film (14) comprises a protection film-forming layer (12) which is composed of a resin composition and protects a surface of the semiconductor element (18) opposite to the surface of the semiconductor element (18) mounted on the base material, and a dicing sheet (13) laminated on the protection film-forming layer.</p> |
申请公布号 |
KR20110128863(A) |
申请公布日期 |
2011.11.30 |
申请号 |
KR20117021282 |
申请日期 |
2010.02.10 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
HIRANO TAKASHI;YOSHIDA MASATO |
分类号 |
H01L21/48;C08F290/06;H01L21/301;H01L23/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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