发明名称 PRINTED CIRCUIT BOARD AND THE METHOD OF MANUFACTURING THEREOF
摘要 PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a sol-gel layer between circuit wires of a circuit layer, thereby preventing electrical disconnection. CONSTITUTION: A metal substrate(10) is prepared. An anode oxidizing layer(20) is formed by anodizing the frontal surface of the metal substrate. The anode oxidizing layer is formed on circuit layers(30,31). A photo catalyst is coated between circuit wires of the circuit layers which expose the anode oxidizing layer and the photo catalyst is hardened to form a first sol-gel layer(50).
申请公布号 KR20110128663(A) 申请公布日期 2011.11.30
申请号 KR20100048232 申请日期 2010.05.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, SUNG KEUN;SHIN, SANG HYUN;KIM, KWANG SOO;CHOI, SEOG MOON
分类号 H05K1/02;H05K3/06;H05K3/18 主分类号 H05K1/02
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