发明名称 |
PRINTED CIRCUIT BOARD AND THE METHOD OF MANUFACTURING THEREOF |
摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a sol-gel layer between circuit wires of a circuit layer, thereby preventing electrical disconnection. CONSTITUTION: A metal substrate(10) is prepared. An anode oxidizing layer(20) is formed by anodizing the frontal surface of the metal substrate. The anode oxidizing layer is formed on circuit layers(30,31). A photo catalyst is coated between circuit wires of the circuit layers which expose the anode oxidizing layer and the photo catalyst is hardened to form a first sol-gel layer(50). |
申请公布号 |
KR20110128663(A) |
申请公布日期 |
2011.11.30 |
申请号 |
KR20100048232 |
申请日期 |
2010.05.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, SUNG KEUN;SHIN, SANG HYUN;KIM, KWANG SOO;CHOI, SEOG MOON |
分类号 |
H05K1/02;H05K3/06;H05K3/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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