发明名称 Camera module and fabrication method thereof
摘要 A camera module is disclosed. The camera module includes an imager sensor device comprising a microlens array. A lens set overlies the imager sensor device. A dry film type photoresist spacer is interposed between the imager sensor device and the lens set, wherein the dry film type photoresist spacer has an opening above the microlens array. A fabrication method of the camera module is also disclosed.
申请公布号 EP2390702(A1) 申请公布日期 2011.11.30
申请号 EP20100014209 申请日期 2010.11.02
申请人 VISERA TECHNOLOGIES COMPANY LIMITED;OMNIVISION TECHNOLOGIES, INC. 发明人 LIN, TZY-YING;CHENG, CHIEH-YUAN;LIN, HUNG-YEH
分类号 G02B7/02;H01L27/146;H01L31/0203;H01L31/0232 主分类号 G02B7/02
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