发明名称 |
Camera module and fabrication method thereof |
摘要 |
A camera module is disclosed. The camera module includes an imager sensor device comprising a microlens array. A lens set overlies the imager sensor device. A dry film type photoresist spacer is interposed between the imager sensor device and the lens set, wherein the dry film type photoresist spacer has an opening above the microlens array. A fabrication method of the camera module is also disclosed. |
申请公布号 |
EP2390702(A1) |
申请公布日期 |
2011.11.30 |
申请号 |
EP20100014209 |
申请日期 |
2010.11.02 |
申请人 |
VISERA TECHNOLOGIES COMPANY LIMITED;OMNIVISION TECHNOLOGIES, INC. |
发明人 |
LIN, TZY-YING;CHENG, CHIEH-YUAN;LIN, HUNG-YEH |
分类号 |
G02B7/02;H01L27/146;H01L31/0203;H01L31/0232 |
主分类号 |
G02B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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