| 摘要 |
PURPOSE: An apparatus for fabricating a semiconductor device and a fabricating method are provided to improve the progressing efficiency of a process by modularizing an apparatus, which is for dividing semiconductor devices into a discrete unit, as a polishing module, a patterning module, and a dicing module. CONSTITUTION: A polishing module(100) grinds the back side of a substrate in which semiconductor devices are formed. A patterning module(200) forms the photoresist pattern of a cut line on the ground back side of the substrate. A dicing module(300) etches the substrate and separates the substrate into the semiconductor devices of a discrete unit in the cut line. A protection element attaching chamber attaches a protection element to the front of the substrate. A first transferring chamber transfers the substrate to the protection element attaching chamber and a grinding chamber.
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