发明名称 Over-molded fluid interconnect
摘要 A fluid interconnect for a fluid enclosure includes an overmolded sealing surface of a thermoplastic elastomeric material, the sealing surface having an opening, the sealing surface overmolded upon a thermoplastic surface of a fluid enclosure; and a wall of the thermoplastic elastomeric material connected to the sealing surface, the wall enclosing a pathway, the pathway communicating with the opening at a first end; and a layer connected to the wall, the layer closing the pathway at a second end.
申请公布号 US8066358(B2) 申请公布日期 2011.11.29
申请号 US20070699937 申请日期 2007.01.30
申请人 OGLE HOLLI C.;STATHEM RALPH L.;LUNCEFORD STEVEN;LIDDELL GARRY P.;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 OGLE HOLLI C.;STATHEM RALPH L.;LUNCEFORD STEVEN;LIDDELL GARRY P.
分类号 B41J2/175 主分类号 B41J2/175
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