发明名称 |
Multi-layer circuit assembly and process for preparing the same |
摘要 |
Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included. |
申请公布号 |
US8065795(B2) |
申请公布日期 |
2011.11.29 |
申请号 |
US20070760217 |
申请日期 |
2007.06.08 |
申请人 |
OLSON KEVIN C.;WANG ALAN G.;PPG INDUSTRIES OHIO, INC |
发明人 |
OLSON KEVIN C.;WANG ALAN G. |
分类号 |
H01K3/22 |
主分类号 |
H01K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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