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发明名称
Sub mounting substrate for packaing light emitting diode and method for fabricating the same
摘要
申请公布号
KR101086995(B1)
申请公布日期
2011.11.29
申请号
KR20040114590
申请日期
2004.12.29
申请人
发明人
分类号
H01L33/62
主分类号
H01L33/62
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代理人
主权项
地址
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