发明名称 Via structure of printed circuit board
摘要 A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB having a plated sidewall (230) plated on its inner surface, and a first clearance hole (271) is defined in a first inner layer (260) of the PCB around the sidewall. A first transmission line (210) defined on the top surface of the PCB is coupled to the upper cap, a first void (273) extending from a boundary of the first clearance hole being disposed along the layout direction of the first transmission line.
申请公布号 US8067700(B2) 申请公布日期 2011.11.29
申请号 US20070927710 申请日期 2007.10.30
申请人 PAI YU-CHANG;HSU SHOU-KUO;LIU CHIEN-HUNG;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 PAI YU-CHANG;HSU SHOU-KUO;LIU CHIEN-HUNG
分类号 H05K1/11 主分类号 H05K1/11
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