发明名称 Defect-free junction formation using laser melt annealing of octadecaborane self-amorphizing implants
摘要 A method and apparatus for implanting a semiconductor substrate with boron clusters. A substrate is implanted with octadecaborane by plasma immersion or ion beam implantation. The substrate surface is then melted, resolidified, and annealed to completely dissociate and activate the boron clusters.
申请公布号 US8067302(B2) 申请公布日期 2011.11.29
申请号 US20090563746 申请日期 2009.09.21
申请人 LI JIPING;APPLIED MATERIALS, INC. 发明人 LI JIPING
分类号 H01L21/26 主分类号 H01L21/26
代理机构 代理人
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