发明名称 |
Embedded integrated circuit package system and method of manufacture thereof |
摘要 |
A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel. |
申请公布号 |
US8067832(B2) |
申请公布日期 |
2011.11.29 |
申请号 |
US20100964638 |
申请日期 |
2010.12.09 |
申请人 |
ONG YOU YANG;MERILO DIOSCORO A.;CHOW SENG GUAN;STATS CHIPPAC LTD. |
发明人 |
ONG YOU YANG;MERILO DIOSCORO A.;CHOW SENG GUAN |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|