发明名称 |
Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
摘要 |
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
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申请公布号 |
US8067253(B2) |
申请公布日期 |
2011.11.29 |
申请号 |
US20050314988 |
申请日期 |
2005.12.21 |
申请人 |
FERGUSON SCOTT WAYNE;MEHRABI ALI;MEHRABI REZA;AVERY DENNISON CORPORATION |
发明人 |
FERGUSON SCOTT WAYNE;MEHRABI ALI;MEHRABI REZA |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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