发明名称 |
Semiconductor device and a method of manufacturing the same |
摘要 |
A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mounted over the wiring substrate and including a plurality of first pads electrically connected respectively to the first electrodes, and a second semiconductor chip stacked over the first semiconductor chip and including a plurality of second pads electrically connected respectively to the second electrodes; encapsulating the first and second semiconductor chips; and performing electrical tests on the first and second semiconductor chips by use of the test electrodes, after the encapsulating of the first and second semiconductor chips.
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申请公布号 |
US8067251(B2) |
申请公布日期 |
2011.11.29 |
申请号 |
US20100982032 |
申请日期 |
2010.12.30 |
申请人 |
MASUDA MASACHIKA;USAMI TOSHIHIKO;ELPIDA MEMORY, INC. |
发明人 |
MASUDA MASACHIKA;USAMI TOSHIHIKO |
分类号 |
H01L21/66;H01L25/18;H01L21/60;H01L23/31;H01L25/065;H01L25/07 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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