发明名称 |
Conductive metal ball bonding with electrostatic discharge detection |
摘要 |
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer. |
申请公布号 |
US8066171(B1) |
申请公布日期 |
2011.11.29 |
申请号 |
US201113012392 |
申请日期 |
2011.01.24 |
申请人 |
RAKPONGSIRI PORNCHAI;POTHAM JEERASAK;WESTERN DIGITAL TECHNOLOGIES, INC. |
发明人 |
RAKPONGSIRI PORNCHAI;POTHAM JEERASAK |
分类号 |
B23K37/00;B23K31/02 |
主分类号 |
B23K37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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