发明名称 Conductive metal ball bonding with electrostatic discharge detection
摘要 An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.
申请公布号 US8066171(B1) 申请公布日期 2011.11.29
申请号 US201113012392 申请日期 2011.01.24
申请人 RAKPONGSIRI PORNCHAI;POTHAM JEERASAK;WESTERN DIGITAL TECHNOLOGIES, INC. 发明人 RAKPONGSIRI PORNCHAI;POTHAM JEERASAK
分类号 B23K37/00;B23K31/02 主分类号 B23K37/00
代理机构 代理人
主权项
地址