发明名称 Semiconductor device having an SOI structure, manufacturing method thereof, and memory circuit
摘要 The present invention provides a semiconductor device capable of suppressing a body floating effect, and a manufacturing method thereof. A semiconductor device having an SOI structure includes a silicon substrate, a buried insulating layer formed on the silicon substrate, and a semiconductor layer formed on the buried insulating layer. The semiconductor layer has a body region of a first conduction type, a source region of a second conduction type and a drain region of the second conduction type, and a gate electrode is formed on the body region between the source region and the drain region via a gate oxide film. The source region includes an extension layer of the second conduction type, and a silicide layer which makes contact with the extension layer at its side face, and a crystal defect region is formed on a region of a depletion layer generated in a boundary portion between the silicide layer and the body region.
申请公布号 US8067804(B2) 申请公布日期 2011.11.29
申请号 US20050251911 申请日期 2005.10.18
申请人 MAEGAWA SHIGETO;IPPOSHI TAKASHI;RENESAS ELECTRONICS CORPORATION 发明人 MAEGAWA SHIGETO;IPPOSHI TAKASHI
分类号 H01L29/786 主分类号 H01L29/786
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