| 摘要 |
The largest stress is created in the vicinity of the boundary between an edge of a bus bar electrode in a solar cell and a surface of a semiconductor substrate, and stress are easily concentrated. Accordingly, defects such as micro cracks occur in the semiconductor substrate, which develop into a large craze with the defects as its starting point. In connecting bus bar electrodes 4 a and 5 a in the solar cell by an inner lead 8 , therefore, a solder 6 is not brought into contact with edges along the longitudinal direction if the bus bar electrodes 4 a and 5 a and portions F from the edges to a predetermined distance a inward therefrom, and is brought into direct contact with a filler 10. |
