发明名称 |
Fabricating method for printed circuit board |
摘要 |
A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity. |
申请公布号 |
US8065797(B2) |
申请公布日期 |
2011.11.29 |
申请号 |
US20070896774 |
申请日期 |
2007.09.05 |
申请人 |
WATANABE RYOICHI;MIN BYOUNG-YOUL;YOO JE-GWANG;KIM JOON-SUNG;KIM SEUNG-CHUL;KANG MYUNG-SAN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
WATANABE RYOICHI;MIN BYOUNG-YOUL;YOO JE-GWANG;KIM JOON-SUNG;KIM SEUNG-CHUL;KANG MYUNG-SAN |
分类号 |
H01K3/10;H05K1/00;H05K1/09;H05K3/02;H05K3/10;H05K3/36 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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