发明名称 ENCAPSULATION MATERIAL FORMING APPARATUS AND METHOD
摘要 PURPOSE: An envelope material forming device and a method thereof are provided to minimize a resin moving path and to minimize the consumption of resin by reducing a distance between a resin supply location and a forming cavity. CONSTITUTION: An envelope material forming device comprises a fixed mold(20), a moving mold(30), an insert cavity block(40), and a single resin loading space(38). A substrate(10) installs to the fixed mold. The moving mold is arranged to be faced with the fixed mold. The insert cavity block is located between the fixed mold and moving mold. The resin loading space is formed between the insert cavity block and moving mold. The insert cavity block has multiple forming cavities(41) and multiple resin inlet ports(42). Multiple resin inlet ports directly interlink all forming cavities and single resin loading space of the insert cavity block in a vertical direction.
申请公布号 KR101087031(B1) 申请公布日期 2011.11.28
申请号 KR20100101948 申请日期 2010.10.19
申请人 SHINHANDIAMONDINDUSTRIAL CO., LTD. 发明人 SEUK, DAE SU;PARK, EUN SOOK;CHOI, YOUNG GYU;HWANG, DONG JOO
分类号 B29C45/14;B29C39/10 主分类号 B29C45/14
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