| 摘要 |
<p>Disclosed is a liquid encapsulating resincomposition containing an epoxy resin (A), an amine typecuring agent (B), and a basic compound (C), wherein, in case that the liquid encapsulating resin composition is filled between a semiconductor element and a substrate connected to each other by solder bumps, the residue of a fluxing agent used for forming the solder bump connectionis removed.NO FIGURE</p> |
