| 摘要 |
<p>An electronic component punching out apparatus is provided with a supply reel (7) whereupon a carrier tape (1) is wound; a take-up reel (25) for taking up the carrier tape wound on the supply reel; and a die apparatus (9) for punching out a semiconductor chip mounted on the carrier tape from a portion horizontally supported between the carrier tape supply reel and the carrier tape take-up reel. The die apparatus is composed of a lower die (11), which is arranged to be driven in vertical directions so as to support the lower surface of the horizontal portion of the carrier tape by being driven upward; and an upper die (12), which is arranged to be driven in the vertical directions by facing an upper part of the lower die, applies pressure to the upper surface of a carrier tape portion whose lower surface is supported by the lower die, by being driven downward, and the semiconductor chip is punched out from the carrier tape.</p> |
