| 摘要 |
<p>PURPOSE: A method for manufacturing LED package is provided to improve heat radiation efficiency by emitting a heat which is generated form a light emitting chip to outside through a metal substrate. CONSTITUTION: A metal substrate is prepared. The insulating layer of a constant thickness is formed on the upper side of the metal substrate. A pattern circuit layer(112) is formed on the insulating layer. A chip array groove which exposes the upper side of the metal substrate to outside by etching the insulating layer and the pattern circuit layer is formed. A light emitting chip(120) which is arranged in the chip array groove is die-attached on the metal substrate. A light emitting diode is wire-bonded with a connection pad of the pattern circuit layer by a conductive wire(130).</p> |
