| 摘要 |
PURPOSE: An apparatus and a method for cutting a substrate are provided to effectively cut a substrate by separating the substrate in a vertical direction to a scribe line. CONSTITUTION: An apparatus for cutting a substrate comprises a first transfer belt(210), first stages(220), a first pressure regulating unit(225), and a first scribing unit. The first transfer belt transfers a substrate(P) in a first direction. The first stages are arranged in both sides of the first transfer belt in parallel to the first direction. The first pressure regulating unit supplies pre-set pressure to the holes of the first stages. The first scribing unit is arranged on the top of the first stages and forms a scribe line on the substrate supported by the first stage. |
