发明名称 SUBSTRATE COOL DOWN CONTROL
摘要 <p>Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.</p>
申请公布号 SG175022(A1) 申请公布日期 2011.11.28
申请号 SG20110071701 申请日期 2010.04.12
申请人 APPLIED MATERIALS, INC. 发明人 NEWMAN, JACOB;KANAWADE, DINESH;BARANDICA, HENRY;MERRY, NIR
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