| 摘要 |
Method for conductively connecting a component on a transparent substrateAbstractThe invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps:the electrical component or the conductive layer is provided with a soldering material inthe area where the component is to be connected to the conductive layer;the soldering material is provided with energy supplied by an energy source, such thatthe soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established. |
