发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME |
摘要 |
OF THE DISCLOSUREA stiffener is provided for use in making semiconductor devices. The stiffener and method of use provided prevent or reduce warpage of a semiconductor package during the assembly process. More particularly, the stiffener functions to prevent or reduce warpage during molding of an assembly of wafers and/or dies. The stiffener may be positioned above the backside or non-active side of an assembly of wafer and/or dies during molding. The presenceof the stiffener prevents or reduces warpage caused by CTE mismatch between the mold material and the wafer and/or under the high temperatures encountered in the process of molding. After molding, the stiffener may continue to provide support to the assembly.FIG. 1W) |
申请公布号 |
SG175665(A1) |
申请公布日期 |
2011.11.28 |
申请号 |
SG20110077070 |
申请日期 |
2009.04.29 |
申请人 |
UNITED TEST AND ASSEMBLY CENTER LTD |
发明人 |
RAVI KANTH KOLAN;ANTHONY SUN YI-SHENG;TOH CHIN HOCK;CATHERINE NG BEE LIANG;ZHANG XUE REN |
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