| 摘要 |
FIELD: heating. ^ SUBSTANCE: cooling device includes thermoelectric modules connected to power supply and installed with gaps in process cavity that is formed with cooled surface and heat exchangers of hot junction. Free space of process cavity is filled with liquid heat insulation the thickness of layer of which is smaller than height of thermoelectric modules, and reflecting coating is applied to layer of liquid heat insulation. ^ EFFECT: increasing the freezing speed of products and solutions, and namely blood plasma, which are placed in polymer packs. ^ 2 cl, 1 dwg |
