发明名称 CMP PAD CONDITIONER AND ITS MANUFACTURING METHOD
摘要 PURPOSE: A CMP pad conditioner and a manufacturing method thereof are provided to improve the cutting performance of the CMP pad conditioner by forming diamond grits with a desirable height at a desirable position. CONSTITUTION: A first mask layer with at least one opening is formed on the surface of a metal base material(10). A substrate plating layer(22) is formed on the surface of the metal base material in the opening. The first mask layer is removed from the surface of the metal base material. A second mask layer with a first opening and a second opening is formed on the surface of the metal base material. Diamond grits(30) are arranged on the surface of the substrate plating layer and the meta base material.
申请公布号 KR101087030(B1) 申请公布日期 2011.11.28
申请号 KR20100055671 申请日期 2010.06.11
申请人 SHINHANDIAMONDINDUSTRIAL CO., LTD. 发明人 KIM, SHIN KYUNG;SONG, BRIAN;PARK, MUN SEAK;CHOI, YOUNG IL;KIM, KANG JUN;JUNG, TAE SOON;KIM, JEONG;BYUN, SUNG KEUN;KIM, KYOUNG JIN;JANG, MYUNG HUN
分类号 H01L21/304 主分类号 H01L21/304
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