APPARATUS AND METHOD FOR WET ETCHING OF WAFER

摘要

PURPOSE: A wet etching apparatus for controlling distance between substrates and a method for etching solar cell substrate using the same are provided to prevent damage to a semiconductor layer by relatively delaying the etching rate of the front side of a solar cell substrate in comparison with that of the back side of the substrate. CONSTITUTION: A chemical reaction tank(210) offers a space for an etching process. A plurality of slot pairs(220) is included in the lower part of the chemical reaction tank. Two substrates(230) are mounted to be adjacent in each slot pair. The plurality of the slot pairs is arranged to be separated at a constant interval. The plurality of the slot pairs includes a first slot pair and a second slot pair which are adjacent.