发明名称 COOLING DEVICE, AND COOLING METHOD OF DRAWING DIE
摘要 <P>PROBLEM TO BE SOLVED: To suppress expansion of a die itself even in a case of continuous forming by more effectively cooling a drawing part of a drawing die and achieve simple configuration by simplifying a cooling structure. <P>SOLUTION: In order to cool a drawing part 5a of an upper die 5 including a cast hole 8, a thermal shielding plate 15 is arranged at a predetermined place around an inner wall of cast holes 8a, 8b positioned at a rear side of a bead part b at least on one side of the upper die 5, so that the cast holes 8a, 8b are made to be a semi-closed space. An inner space is narrowly surrounded by arranging a surrounding member 16 in the cast holes 8a, 8b, and cooling air is supplied into a surrounding space 17 surrounded by the surrounding member 16 from a cooling device body 14 arranged in the cast hole 8a. The cooling air is discharged into the respective cast holes 8a, 8b from opening parts of both sides. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011235305(A) 申请公布日期 2011.11.24
申请号 JP20100107890 申请日期 2010.05.10
申请人 HONDA MOTOR CO LTD 发明人 TANIGUCHI HIROMI
分类号 B21D24/00;B21D37/16 主分类号 B21D24/00
代理机构 代理人
主权项
地址