| 摘要 |
<P>PROBLEM TO BE SOLVED: To attach solder onto a solar cell without subjecting the solar cell to high temperatures. <P>SOLUTION: The method and device employ a solder wire 12 to attach a semiconductor wire in the molten state onto a solar cell 10 under the action of ultrasonic vibrations applied by a sonotrode 18. In order that solder is very precisely attached onto the solar cell 10, without subjecting the solar cell 10 to undesirably high temperatures, the solder wire 12 is supplied into a gap running between heating means 16 and 17 and the sonotrode 18 that applies ultrasonic vibrations. Then, the solder wire 12 is melted and made to flow through the gap onto the solar cell 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
