| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vibration chip with a warp of a vibration arm being suppressed, a vibrator and an oscillator using the vibration chip or an electronic device using the vibration chip. <P>SOLUTION: A vibration chip 1 has a base 16 formed by processing a Z cut quartz plate and three vibration arms 18a, 18b and 18c extending from one end of the base 16 in parallel with one another. On a first surface 12 of each vibration arm 18a 18b and 18c, a first laminate is formed by laminating a first electrode layer 20, a first piezoelectric-body layers 22 and a second electrode layer 26 in this order as an excitation electrode. In addition, on a second surface 10 of the each vibration arm 18a 18b and 18c, a second laminate formed by laminating a metal layer 5 and a second piezoelectric-body layers 7, which are electrically independent of each other, in this order is disposed. For example, Pt, Ti, Ti-Au alloy or the like can be used to form the first electrode layer 20. Further, for example, Al, Cr, Ni or the like can be used to form the metal layer 5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
