| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a test cost by performing a simultaneous collective contact to the entire chips on a wafer in high accuracy and low cost, allowing a Built In Self Test (BIST) to be most efficiently performed for a semiconductor integrated circuit using a built-in circuit. <P>SOLUTION: On a substrate used for a production process of a large liquid crystal display, a probe card capable of the simultaneous collective contact to the entire chips on a wafer in high accuracy and low cost is disposed by patterning the following components using photolithography technique or the like: a contact pad with wafer and required wiring; a correction capacity for frequency characteristic improvement; and a signal switching thin-film transistor, and the like. A point contact by a square pyramid shaped contact terminal and an aluminum oxide film removal effect by an ultrasonic transducer enable a stable electrical connection to a semiconductor chip. <P>COPYRIGHT: (C)2012,JPO&INPIT |
