| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting component test module capable of testing a light-emitting component mounting a semiconductor light-emitting element in an environment at a temperature that is higher or lower than a normal temperature, without mounting the light-emitting component on a substrate or the like, and to provide a light-emitting component test apparatus. <P>SOLUTION: A light-emitting component test module 10 includes: a base substance 21 having a plurality of recessed parts 211 provided one surface thereof; a plurality of elastic bodies 22 embedded in the plurality of the recessed parts 211 of the base substance 21 respectively; a flexible film 30 having a wiring which is provided in contact with one surface of the base substance 21 having the plurality of the elastic bodies 22 embedded in the plurality of the recessed parts 211, and is electrically connected to a plurality of light-emitting components 2 arranged on the plurality of the elastic bodies 22, formed therein; and a holding body 24 for pressing the plurality of the light-emitting components 2 to the plurality of the elastic bodies 22 embedded in the plurality of the recessed parts 211 of the base substance 21 respectively through the flexible film 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
