发明名称 EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PURPOSE: An embedded printed circuit board and a manufacturing method of the same are provided to prevent a bridge by forming a connector which is filled with a solder paste. CONSTITUTION: In an embedded printed circuit board and a manufacturing method of the same, a bonding layer(30) adheres a device to a substrate. A connection unit(90) electrically connects device to a circuit pattern. The connection unit fills the solder paste in an opening.
申请公布号 KR101086835(B1) 申请公布日期 2011.11.24
申请号 KR20100050005 申请日期 2010.05.28
申请人 LG INNOTEK CO., LTD. 发明人 YOON, HYE SUN;LEE, MIN SEOK
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
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