发明名称 |
EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PURPOSE: An embedded printed circuit board and a manufacturing method of the same are provided to prevent a bridge by forming a connector which is filled with a solder paste. CONSTITUTION: In an embedded printed circuit board and a manufacturing method of the same, a bonding layer(30) adheres a device to a substrate. A connection unit(90) electrically connects device to a circuit pattern. The connection unit fills the solder paste in an opening.
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申请公布号 |
KR101086835(B1) |
申请公布日期 |
2011.11.24 |
申请号 |
KR20100050005 |
申请日期 |
2010.05.28 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
YOON, HYE SUN;LEE, MIN SEOK |
分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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