| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be finely processed due to photosensitivity and can be developed by using a dilute alkali aqueous solution and is curable at a low temperature (200°C or less) and the hardening film obtained from which is very flexible and which is excellent in terms of electric insulation reliability, solder heat resistance, organic solvent resistance and fire retardancy and has small warpage after hardening. <P>SOLUTION: A photosensitive resin composition includes at least (A) a binder resin, (B) a photosensitive film, and (C) a photopolymerization initiator. The (A) binder resin is obtained by copolymerisation of at least (a) (meth)acrylic acid and (b) a phosphine oxide compound expressed by the following general formula (1). <P>COPYRIGHT: (C)2012,JPO&INPIT |
