发明名称 CIRCUIT BOARD AND METHOD FOR TESTING COMPONENT MOUNTED IN THE CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a board structure for testing a connection state of each device and a method for testing thereof, in an embedded circuit board in which an active element and a passive element are mounted inside the board. <P>SOLUTION: There is disclosed a circuit board and a method for testing elements mounted inside the circuit board. The circuit board according to an embodiment of the present invention includes: an active element that is mounted inside the circuit board and includes at least one connection terminal; a passive element of which one terminal is electrically connected to one of the connection terminals of the active element and the other terminal is electrically connected to a signal pad on a surface of the circuit board; and a test pad that is electrically connected to the one terminal of the passive element. According to the present invention, even when the active element and the passive element are mounted inside the board, a connection state of each element can be effectively tested, so that whether or not defects occur in the circuit board can be easily determined. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011238891(A) 申请公布日期 2011.11.24
申请号 JP20100192270 申请日期 2010.08.30
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM HYUN HO;JEONG WON GUN;JEONG YEOL GYU
分类号 H05K3/46;G01R31/28;H05K3/00 主分类号 H05K3/46
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