| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a joint material whose joint reliability is improved, a semiconductor device using the joint material, and a method of manufacturing same. <P>SOLUTION: As a joint material for jointing a semiconductor element and a frame or substrate, a clad material is used in which an Al system layer 101 is sandwiched by an X system layer 102 (X=Ge, Mg, In, Sn, Ag, Au, Ga), and further, the outside of the X system layer 102 is sandwiched by a Zn system layer 103. By jointing using a clad material like this, the melting point of material is lowered and cracking of the semiconductor element is prevented, and further, a void ratio of the joint part can be suppressed to be 10 wt.% or less. Further, wettability between the semiconductor element and the frame or substrate can be assured, thus, a high reliability of the joint part is assured. <P>COPYRIGHT: (C)2012,JPO&INPIT |
