| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer mounting device that uses hardened material of fluid adhesive agent and has high adsorption and desorption performance, and a method of manufacturing the wafer mounting device. <P>SOLUTION: An adhesive layer 30 through which the back surface of a plate 12 for adsorbing a wafer W and the surface of a cooling plate 20 are adhesively attached to each other has a main adhesive portion 31 formed of a hardened material of fluid adhesive agent, an outer peripheral adhesive portion 32, a gas supply hole adhesive portion 33, a lift pin hole adhesive portion 34 and terminal hole adhesive portions 35, 36. The outer peripheral edge of the back surface of the plate 12 and the outer peripheral edge of the surface of the cooling plate 20 are adhesively attached to each other by the outer peripheral adhesive portion 32, and the back surface of the plate 12 and the outer peripheral edge of each of a gas supply hole 23, a lift pin hole 24 and terminal holes 25, 26 in the surface of the cooling plate 20 are adhesively attached to each other by the gas supply hole adhesive portion 33, the lift pin hole adhesive portion 34 and the terminal hole adhesive portions 35, 36. A wafer mounting device having this structure has higher adsorption and desorption performance than a wafer mounting device which does not have the structure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
