| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP process that removes metal selectively and relatively slowly such that dishing can be minimized, and products therefrom. <P>SOLUTION: A substrate is polished by a CMP product using alumina particles each having a silica coated particle surface in which at least 90% of the alumina particles have primary particle widths of not more than 50 nanometers, less than 10% thereof having primary particle sizes greater than 100 nm, a BET surface area thereof is at least 50 m<SP POS="POST">2</SP>/g, and the alumina particles have an α-alumina content of at least 90% by weight. <P>COPYRIGHT: (C)2012,JPO&INPIT |
