| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat conduction device which constitutes a heat energy conduction structure body or a heat dissipation structure body having a specific coupling form sandwiched by at least two prestressed layers. <P>SOLUTION: One end or one surface of a relay heat conductor 102 is coupled to heat-conduct a first heat energy body 101 for heat evolution or cooling. Also, the other end or the other surface of the relay heat conductor 102 is coupled to an interface heat conductor 103. Because the interface heat conductor 103 has better heat conducting characteristic than the relay heat conductor, a better heat energy transfer can be obtained. Having a coupling structure sandwiched by prestressed layers between each structure layer reduces the volume, and having a prestressed gap 500 in order to form prestressed layers for sandwiching or supporting the coupling structure from the outside secures contact with good heat conduction and prevents coupling defects of heat conducting surfaces and bad heat conduction due to falling or deformation of multi-layer structural materials caused by different thermal expansion coefficients. <P>COPYRIGHT: (C)2012,JPO&INPIT |
