METHOD AND DEVICE FOR THERMALLY COUPLING A HEAT SINK TO A COMPONENT
摘要
<p>A method and a device for thermally coupling a heat sink to a component are provided, wherein a thermal filler and an intermediate layer are applied between the heat sink and the component.</p>
申请公布号
WO2011144249(A1)
申请公布日期
2011.11.24
申请号
WO2010EP57039
申请日期
2010.05.21
申请人
NOKIA SIEMENS NETWORKS OY;VOSS, STEFAN;SIEBERT, ANDREAS
