| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component which has a wet non-plating conductor film with high wire bondability on a surface of a substrate, and the method of manufacturing the same. <P>SOLUTION: This electronic component 10 is provided with an inorganic base material 20, a conductor film 30 formed on the surface of the base material, and bonding wires 50, 55 bonded to part of the conductor film, and has wire-bonding parts 40, 45 formed at least in part of the component. At least the part of the conductor film which forms a wire-bonding part contains Ag system metal which includes Ag and an alloy consisting mainly of Ag, as well as a metallic oxide which coats the Ag system metal and is composed of any one selected from a group composed of Al, Zr, Ti, Y, Ca, Mg and Zn. The amount of the metallic oxide which coats the Ag system metal is equivalent to 0.02 to 0.1 pts. mass to 100 pts. mass of the Ag system metal. <P>COPYRIGHT: (C)2012,JPO&INPIT |
