| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor handling method which can prevent cracks in a semiconductor wafer from occurring when adhesive tape stuck to an adhesive layer is separated. <P>SOLUTION: In an arrangement comprising an adhesive tape 11 with weak adhesive properties and a semiconductor wafer 1 which is bonded to a semiconductor support plate 2 via an adhesive layer 3 and which includes a plurality of chips 5 in an area other than a peripheral portion 4, the chips 5 of the semiconductor wafer 1 are opposedly stuck to the adhesive tape 11, the semiconductor support plate is separated from the semiconductor wafer 1, and the remaining adhesive layer 3 on the semiconductor wafer 1 is separated after sticking the adhesive tape 12 thereto, to remove the adhesive layer 3. In the handling method described above, a coating of silicone rubber in liquid form is applied to the whole of a chip surface 7 of the semiconductor wafer 1 and then hardened to form an elastic silicone rubber layer 20, and the silicone rubber layer 20 is stuck to the adhesive tape 12 simultaneously when the adhesive tape 12 and the chips 5 of the semiconductor wafer 1 are stuck together. <P>COPYRIGHT: (C)2012,JPO&INPIT |
