| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate sticking method capable of improving sticking accuracy between a semiconductor wafer and a supporting substrate for reinforcement, and to provide an apparatus employing the same. SOLUTION: The supporting substrate W2 taken out from a supporting substrate feeding section 3 by a robot arm is aligned on a first alignment stage 9, and then, transferred to a holding section 12 to stick a double-sided sticking sheet T1 on the supporting substrate W2. The supporting substrate W2 having the double-sided sticking sheet is oppositely disposed on a wafer W1 taken out from a cassette C2 of the wafer feeding portion 4 in a substrate sticking mechanism 20, and the surface of a double-sided sticking sheet T2 is stuck on the wafer W1 while pressing the non-sticking surface of the supporting substrate W2 using a sticking roller 40. COPYRIGHT: (C)2008,JPO&INPIT |
