| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate laminating method that improves adhering accuracy of a workpiece, such as a semiconductor wafer, and a supporting substrate for reinforcement. <P>SOLUTION: A supported substrate W2 supported through engagement at a circumferential part with a plurality of engaging claws 38 is opposed with each other in the proximity to an adhering surface of both-surface adhesive sheet of a wafer W1. A pressing member 39 constituted with an almost semi-spherical elastic material from almost the center of non-adhering surface of the supported substrate W2 is pressed. Thereby, while the pressing member 39 is elastically deformed to be in flat contact with the front surface of the supported substrate, the supported substrate W2 is adhered to the wafer W1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
