| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board which can easily achieve planarization of substrate surface. <P>SOLUTION: A printed circuit board comprises: a first insulator layer 11; first wiring patterns 21, 22, 23, and 24 placed in a part of the upper surface of the first insulator layer 11; and first non-conductive patterns 30, 31, and 32 placed in other part of the upper surface of the first insulator layer 11. The first non-conductive patterns 30, 31, and 32 are placed so that the pattern density is uniform within the same layer, thereby planarizing the surface of the insulator layer to be formed thereupon. <P>COPYRIGHT: (C)2012,JPO&INPIT |
