| 摘要 |
<P>PROBLEM TO BE SOLVED: To greatly reduce the incidence rate of junction-failure products by enhancing the junction between a solder ball and a silicon wafer terminal. <P>SOLUTION: A solder ball mounting flux 4 contains fine solder particle powder having the same component and mixing ratio as a solder ball in the volume ratio range from 8 to 15%. An under barrier metal film 3 comprising non-electrolytic nickel plating and non-electrolytic gold plating is formed on an aluminum terminal 2 of a silicon wafer 1. Thereafter, the solder ball mounting flux 4 is coated on the under barrier metal film 3. A solder ball 5 is mounted on the under barrier metal film 3 with adhesive force of the flux 4, and then heated to bond the solder ball 5 to the under barrier metal film 3, thereby forming a bump. <P>COPYRIGHT: (C)2012,JPO&INPIT |
