发明名称 METHOD OF MANUFACTURING FLOOR STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a simpler and more economical adhesion method than the conventional adhesion method for a floor structure that can stick a new floor material without breaking a substrate material and removing the remaining adhesive, in the reform and repair works. <P>SOLUTION: When resticking a floor material in the adhesion method for a floor structure where the floor material is stuck on a substrate material by an adhesive, the old floor material is peeled in the boundary surface between the rear cushion of an old floor material and an old adhesive for fixing the old floor material (interface breakage), after which a new adhesive is applied on the remaining adhesive layer, and the new floor material is stuck. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011236620(A) 申请公布日期 2011.11.24
申请号 JP20100108321 申请日期 2010.05.10
申请人 KANEKA CORP 发明人 ITO AKIRA
分类号 E04F15/00;E04F15/04 主分类号 E04F15/00
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