发明名称 |
Printed circuit board and semiconductor package with the same |
摘要 |
Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill. |
申请公布号 |
US2011286191(A1) |
申请公布日期 |
2011.11.24 |
申请号 |
US20100926337 |
申请日期 |
2010.11.10 |
申请人 |
KIM BYOUNG CHAN;SHIN YOUNG HWAN;KIM CHIN KWAN;KIM DONG WON;KANG KUI WON;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM BYOUNG CHAN;SHIN YOUNG HWAN;KIM CHIN KWAN;KIM DONG WON;KANG KUI WON |
分类号 |
H05K7/06 |
主分类号 |
H05K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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